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1
Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene)

Lee, WH; Ko, YK; Byun, IJ; Seo, BS; Lee, JG; Reucroft, PJ; Lee, JU; et al, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.19, no.6, pp.2974 - 2978, 2001-11

2
Reaction characteristics between Cu thin film and RF inductively coupled Cl-2 plasma without/with UV irradiation

Kwon, MS; Lee, JeongYong; Choi, KS; Han, CH, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.37, no.7, pp.4103 - 4108, 1998-07

3
Reaction mechanism of low-temperature Cu dry etching using an inductively coupled Cl-2/N-2 plasma with ultraviolet light irradiation

Kwon, MS; Lee, JeongYong, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.146, no.8, pp.3119 - 3123, 1999-08

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