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Showing results 1 to 4 of 4

1
Effect of Ag Addition on the Ripening Growth of Cu6Sn5 Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow

Cho, Moon-Gi; Park, Yong-Sung; Seo, Sun-Kyoung; Paik, Kyung-Wook; Lee, Hyuck-Mo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.12, pp.1939 - 1946, 2011-12

2
Effect of welding heat input on microstructure and mechanical properties of simulated HAZ in Cu containing microalloyed steel

Amer, AE; Koo, MY; Lee, KH; Kim, SH; Hong, Soon-Hyung, JOURNAL OF MATERIALS SCIENCE, v.45, pp.1248 - 1254, 2010-03

3
Sn-Ag-Cu 솔더의 응고 경로에 따른 미세 구조 연구 및 계면 IMC 성장 거동 모델링 = Study on microstructures through the solidification paths of Sn-Ag-Cu ternary system and modeling for predicting IMC layer thickness of solder jointlink

김현득; Kim, Hyun-Deuk; et al, 한국과학기술원, 2004

4
The Crystal Orientation of beta-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.12, pp.2461 - 2469, 2009-12

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