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The formation of Cu-Sn intermetallic compound and its effect on the fracture behavior of 80Sn-20Pb electrodeposits on Cu-based leadframe alloy Kim, Jeong-Han; Suh, Min-Suk; Kwon, Hyuk-Sang, SURFACE COATINGS TECHNOLOGY, v.82, no.1-2, pp.23 - 28, 1996-07 |
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