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A Study on Nano-Sized Silica Contents and Size Effect in Non-conductive Films (NCFs) for Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection Lee, Hanmin; Lee, Seyong; Cho, Semin; Yu, Younghyun; Park, Jongho; Paik, Kyung-Wook, 67th IEEE Electronic Components and Technology Conference, ECTC 2017, pp.399 - 404, Institute of Electrical and Electronics Engineers Inc., 2017-05 |
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