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Study on the thermal cycle and drop test reliability of system-in-packages with an Embedded die Yu, SY; Kwon, YM; Kim, J; Jeong, T; Choi, S; Paik, Kyung-Wook, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.460 - 466, ECTC, 2011-05-31 |
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