Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Suk, Kyung-lim
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| A Study on the Fine Pitch Chip Interconnection Using Cu/SnAg Bumps and B-stage Non-conductive Films (NCFs) for 3D-TSV Vertical Interconnection Choi, Yong-Won; Shin, Ji-Won; Kim, Young Soon; Suk, Kyung-lim; Kim, Il; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
| Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films Choi, Yong-Won; Shin, Ji Won; Suk, Kyung-lim; Kim, Youngsoon; Kim, Il; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.11, pp.4214 - 4223, 2014-11 |
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