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Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 |
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