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Showing results 1 to 11 of 11

1
A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications

Zhang, Shuye; Lin, Tiesong; He, Peng; Zhao, Ning; Huang, Mingliang; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.12, pp.2087 - 2094, 2017-12

2
A study on the high frequency performance of solder ACFs joints for flex-on-board applications using coplanar waveguide

Zhang, Shuye; Lin, Tiesong; He, Peng; Park, Junyong; Park, Gap Yeol; Song, Huijin; Kim, Joungho; et al, 68th IEEE Electronic Components and Technology Conference, ECTC 2018, pp.2404 - 2409, Institute of Electrical and Electronics Engineers Inc., 2018-05

3
A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature

Zhang, Shuye; Yang, Ming; Wu, Yang; Du, Jikun; Lin, Tiesong; He, Peng; Huang, Mingliang; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.3, pp.383 - 391, 2018-03

4
A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of SnBi58 based Anisotropic Conductive Films

Zhang, Shuye; Huang, Mingliang; Wu, Yang; Yang, Ming; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2022 - 2028, IEEE, 2019-05

5
A Study on the Preparation and Properties of Conductive Adhesive Filled with Multi-component Fillers for Green Packaging

Zhang, Shuye; Yang, Ming; Zhang, Yanxin; Wang, Qian; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, 20th International Conference on Electronic Materials and Packaging (EMAP), IEEE, 2018-12

6
A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

Zhang, Shuye; Qi, Xiaoquan; Yang, Ming; Cao, Yang; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.10, pp.9171 - 9183, 2019-05

7
Cu-Cu joining using citrate coated ultra-small nano-silver pastes

Zhang, Shuye; Wang, Qian; Lin, Tiesong; Zhang, Pengzhe; He, Peng; Paik, Kyung-Wook, JOURNAL OF MANUFACTURING PROCESSES, v.62, pp.546 - 554, 2021-02

8
Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly

Zhang, Shuye; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.78, pp.181 - 189, 2017-11

9
Highly mechanical and high-temperature properties of Cu–Cu joints using citrate-coated nanosized Ag paste in air

Wang, Qian; Zhang, Shuye; Lin, Tiesong; Zhang, Pengzhe; He, Peng; Paik, Kyung-Wook, PROGRESS IN NATURAL SCIENCE-MATERIALS INTERNATIONAL, v.31, no.1, pp.129 - 140, 2021-02

10
Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

Zhang, Shuye; Yang, Ming; Jin, Ming Liang; Huang, Wen-Can; Lin, Tiesong; He, Peng; Lin, Panpan; et al, METALS, v.8, no.1, 2018-01

11
Wettability and interfacial morphology of Sn-3.0Ag-0.5Cu solder on electroless nickel plated ZnS transparent ceramic

Zhang, Shuye; Zhu, Bingxuan; Zhou, Xiang; Wang, Xingxing; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.19, pp.17972 - 17985, 2019-10

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