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1
Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

Lee, BW; Jang, W; Kim, DW; Jeong, J; Nah, JW; Paik, Kyung-Wook; Kwon, D, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.380, pp.231 - 236, 2004-08

2
Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis

Lee, BW; Jeong, JH; Jang, W; Kim, JY; Kim, DW; Kwon, D; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, v.17, pp.1983 - 1988, The Third International Conference On Advanced Materials Development and Performance, 2003

3
Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis

Lee, BW; Jeong, JH; Jang, W; Kim, JY; Kim, DW; Kwon, D; Nah, JW; et al, INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.17, pp.1983 - 1988, 2003-04

4
Evaluation of Thermal Shear Strains in Flips-chip Package by Electronic Speckle Pattern Interferometry (ESPI)

Jang, W; Lee, BW; Kim, DW; Nah, JW; Paik, Kyung-Wook; Kwon, D, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.310 - 314, 2001-11

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