Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Kim, Youngsoon
Showing results 1 to 6 of 6
| Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films Choi, Yong-Won; Shin, Ji Won; Suk, Kyung-lim; Kim, Youngsoon; Kim, Il; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.11, pp.4214 - 4223, 2014-11 |
| Effects of non-conductive film (NCF) and substrate materials properties on the reliability of chip-on-board assembly = NCF와 Substrate 특성이 COB 패키지 신뢰성에 미치는 영향에 대한 연구link Kim, Youngsoon; Paik, Kyoung-Wook; et al, 한국과학기술원, 2016 |
| Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly Kim, Youngsoon; Lee, Seyong; Shin, Ji Won; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.45, no.6, pp.3208 - 3219, 2016-06 |
| Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03 |
| Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 mu m pitch Cu-pillar/Sn-Ag bump interconnection Shin, Ji Won; Kim, Il; Choi, Yong-Won; Kim, Youngsoon; Kang, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.55, no.2, pp.432 - 441, 2015-02 |
| The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40-mu m Fine Pitch Cu-Pillar/Ni/SnAg Microbump Flip-Chip Assembly Lee, SeYong; Park, JongHo; Park, Jae-Hyeong; Lee, HanMin; Shin, SangMyung; Kim, Youngsoon; Kim, Woojeong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.10 - 17, 2019-01 |
Discover
Open Access
Date issued
- 2,164 2020 - 2024
- 6,675 2010 - 2019
- 5,356 2000 - 2009
- 3,582 1990 - 1999
- 982 1980 - 1989