Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Kim, Tae-Wan
Showing results 1 to 12 of 12
| A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding Zhang, Shuye; Kim, Seung-Ho; Kim, Tae-Wan; Kim, Yoo Sun; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.9 - 14, 2015-01 |
| (A) study on nanofiber/Sn58Bi solder anisotropic conductive films (ACFs) interconnection and bending characteristics for flex-on-flex (FOF) assembly = 나노파이버/Sn58Bi 솔더 이방성 전도필름이 Flex-on-Flex (FOF) 접합에서 접속과 굽힘 특성에 미치는 영향에 대한 연구link Kim, Tae-Wan; 김태완; et al, 한국과학기술원, 2016 |
| Applicability of superposition for responses of resistive sensors in a diluted mixed gas environment Park, Kwang Min; Kim, Tae-Wan; Park, Jeong Ho; Park, Chong-Ook, SENSORS AND ACTUATORS B-CHEMICAL, v.239, pp.841 - 847, 2017-02 |
| Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09 |
| Fast initializing solid state electrochemical carbon dioxide sensor fabricated by a tape casting technique using yttria stabilized zirconia and sodium beta alumina heterojunction Han, Hyeuk Jin; Kim, Tae-Wan; Kim, Seongwan; Oh, Soomin; Park, Chong-Ook, SENSORS AND ACTUATORS B-CHEMICAL, v.248, pp.856 - 861, 2017-09 |
| Humidity effects on the initial stabilization behavior of a solid electrochemical CO2 sensor Kim, Tae-Wan; Kim, Jun-Woong; Lee, Sang-Min; Park, Chong-Ook, SENSORS AND ACTUATORS B-CHEMICAL, v.295, pp.65 - 69, 2019-09 |
| Interface Circuit for Three-Electrode Metal-Oxide (MOX) Gas Sensor Park, Jeong-Ho; Park, Kwang-Min; Kim, Tae-Wan; Park, Chong-Ook; Yoo, Hyung-Joun, IEEE Sensors 2015, pp.1279 - 1282, IEEE, 2015-11-03 |
Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding Kim, Tae-Wan; Suk, Kyung-Lim; Lee, Sang-Hoon; Paik, Kyung-Wook, JOURNAL OF NANOMATERIALS, 2013 |
| Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03 |
| Nanofiber ACFs (anisotropic conductive films) for ultra-fine pitch interconnection Paik, Kyung-Wook; Lee, Sang-Hoon; Kim, Tae-Wan, 15th IEEE International Conference on Nanotechnology, IEEE-NANO 2015, pp.581 - 587, Institute of Electrical and Electronics Engineers Inc., 2015-07 |
| Nanofiber Anisotropic Conductive Films (ACF) for Ultra-Fine-Pitch Chip-on-Glass (COG) Interconnections Lee, Sang Hoon; Kim, Tae-Wan; Suk, Kyung-Lim; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.11, pp.4628 - 4636, 2015-11 |
| Three-Electrode Metal-Oxide Gas Sensor System With CMOS Interface IC Park, Jeong Ho; Park, Kwang Min; Kim, Tae-Wan; Shin, Seongheon; Park, Chong-Ook; Yoo, Hyung-Joun, IEEE SENSORS JOURNAL, v.17, no.3, pp.784 - 793, 2017-02 |
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