DSpace at KOASAS
Browsing DSpace

Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Kim, Tae Wan

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 8 of 8

1
A Study on Nanofiber Anisotropic Conductive Films (ACFs)　for Fine Pitch Chip-on-Glass (COG) Interconnections

Lee, Sang Hoon; Kim, Tae Wan; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-29

2
Comparison of the Power Consumption between the Ceramic and Wire Bonding Packaging Methods for Solid- State Electrochemical Carbon dioxide sensors

Kim, Tae Wan; Park, Chong-Ook, 센서학회지, v.25, no.3, pp.173 - 177, 2016-05

3
Effect of Aligned Nanofiber in Nanofiber Solder Anisotropic Conductive Films (ACFs) on　the Solder ball Movement for Flex-on-Flex (FOF) Assembly

Kim, Tae Wan; Lee, Sang Hoon; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28

4
Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100-mu m-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method

Park, Jae-Hyeong; Kim, Tae Wan; Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.7, pp.1127 - 1134, 2016-07

5
Low Temperature Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Sn58Bi Solder Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method

Kim, Tae Wan; Suk, Kyung-Lim; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.461 - 467, The 63rd Electronic Components and Technology Conference, 2013-05-29

6
Plasma-etched Nanofiber Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Interconnection

Lee, Sang Hoon; Kim, Tae Wan; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27

7
Study on Bending Feasibility and Joint Reliability for Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Solder Anisotropic Conductive Films (ACFs) and Ultrasonic (US) Bonding

Kim, Tae Wan; Lee, Tae Ik; Lee, Sang Hoon; Kim, Taek Soo; Paik, Kyung Wook, The 14th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2015-10-14

8
Tape-casted solid electrochemical $CO_2$ sensor with long-term properties = 장기안정성이 개선된 고체 전기화학식 테이프 캐스팅 이산화탄소 센서link

Kim, Tae Wan; Park, Chong-Ook; et al, 한국과학기술원, 2019

Discover

rss_1.0 rss_2.0 atom_1.0