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Showing results 1 to 8 of 8

1
A Study on the behavior of residual stress with water absorption of Si of thin films deposited by electron cyclortron resonance plasma enhanced chemical vapor deposition method

Choi, Si-Kyung; Kim, SP, 2001 MRS Fall Meeting, pp.124 -, 2001

2
A study on the behavior of water absorption of SiOF thin films deposited by electron cyclotron resonance plasma enhanced chemical vapor deposition method

Kim, SP; Choi, Si-Kyung; Park, Y; Chung, I, Thin Films: Stresses and Mechanical Properties IX, v.695, pp.245 - 250, 2001-11-26

3
A study on the crystallographic orientation with residual stress and electrical property of Al films deposited by sputtering

Kim, SP; Choi, HM; Choi, Si-Kyung, THIN SOLID FILMS, v.322, no.1-2, pp.298 - 302, 1998-06

4
Dependence of Deposition Temperature on the Residual Stress in Low Dielectric SIOF Thin Films Deposition by ECRCVD

Choi, Si-Kyung; Kim, SP, The 3rd International Meeting of Pacific Rim Ceramic Societies, 1998

5
ECRCVD에 의해 증착한 SiOF 저유전율 박막의 고유응력 발생원인

최시경; Kim, SP, 추계 한국요업학회, 1999

6
Effect of N2O plasma treatment on the stabilization of water absorption in fluorinated silicon-oxide thin films fabricated by electron-cyclotron-resonance plasma-enhanced chemical-vapor deposition

Kim, SP; Choi, Si-Kyung; Park, Y; Chung, I, APPLIED PHYSICS LETTERS, v.80, no.10, pp.1728 - 1730, 2002-03

7
Effect of water absorption on the residual stress in fluorinated silicon-oxide thin films fabricated by electron-cyclotron-resonance plasma-enhanced chemical-vapor deposition

Kim, SP; Choi, Si-Kyung; Park, Y; Chung, I, APPLIED PHYSICS LETTERS, v.79, no.2, pp.185 - 187, 2001-07

8
The origin of intrinsic stress and its relaxation for SiOF thin films deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition

Kim, SP; Choi, Si-Kyung, THIN SOLID FILMS, v.379, no.1-2, pp.259 - 264, 2000-12

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