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Effects of the properties of Ni-P films on Black pad formation after the ENIG process Kim, Kyoungdoc; Yu, Jin, ICEP 2013, pp.676 - 679, ICEP 2013, 2013-04-12 |
Effects of Under Bump Metallurgy (UBM) Materials on the Corrosion of Electroless Nickel Films Yu, Jin; Kim, Kyoungdoc, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.46A, no.7, pp.3173 - 3181, 2015-07 |
Mechanisms of Black pad formation on Ni-P films during the ENIG process Kim, Jihee; Kim, Kyoungdoc; Kim, Kyuhun; Yu, Jin, EMAP 2013, EMAP 2013, 2013-10-08 |
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