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A study on characteristics and processing parameters of photo-patternable adhesives for MEMS Motion Sensor Wafer Bonding = MEMS 모션센서 웨이퍼 본딩을 위한 감광성 접착제의 특성과 공정변수에 관한 연구link Kim, Jong-Hyun; 김종현; et al, 한국과학기술원, 2011 |
Studies on the Polymer Adhesive Wafer Bonding Method Using Photo-Patternable Materials for MEMS Motion Sensors Applications Kim, Jong-Hyun; Kim, Il; Choi, Yong-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.7, pp.1118 - 1127, 2012-07 |
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