Showing results 1 to 1 of 1
Effects of the Materials Properties of Epoxy Molding Films (EMFs) on Fan-Out Packages (FOPs) Characteristics Shin, Sangmyung; Lee, Hanmin; Kim, JunMo; Lee, Tae-Ik; Kim, Taek-Soo; Kyung, Youjin; Jeong, Minsu; et al, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.1146 - 1151, IEEE, 2019-05 |
Discover