Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Jeong, J
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| Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages Lee, BW; Jang, W; Kim, DW; Jeong, J; Nah, JW; Paik, Kyung-Wook; Kwon, D, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.380, pp.231 - 236, 2004-08 |
| Magnetothermoelectric Effect on Magnetoresistance of CoFeB/Pt Heterostructures Lee, K; Kim, D; Park, Byong-Guk; Jeong, J; Lee, K; Song, H; Sohn, J; et al, Magnetism and magnetic materials conference, Institute of Physics, 2014-11-06 |
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