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Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method Paik, Kyung-Wook; Nah, Jae Woong; Jeon, Young Doo; Yim, Myung Jin |
Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, Young Doo; Paik, Kyung Wook; Bok, Kyoung Soon; Choi, Woo Suk; Cho, Chul Lae, Journal of Electronic Materials v.31 n.5, 520-528, 2000-01 |
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