Showing results 1 to 3 of 3
Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.24, pp.3032 - 3037, 2011-12 |
Tungsten alloying of the Ni(P) films and the reliability of Sn-3.5Ag/NiWP solder joints Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.7, pp.889 - 895, 2011-04 |
무전해 Ni(P)에 W첨가가 무연 솔더와의 계면 반응 및 기계적 신뢰성에 미치는 영향에 대한 연구 = A study on the effect of W alloying in Ni(P) film on the interfacial reactions and mechanical reliabilities in lead-free solderlink 장동민; Jang, Dong-Min; et al, 한국과학기술원, 2011 |
Discover