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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Hur, KR

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Showing results 1 to 4 of 4

1
Characterization of coined solder bumps on PCB pads

Nah, JW; Paik, Kyung-Wook; Kim, WH; Hur, KR, 52nd Electronic Components and Technology Conference, pp.154 - 160, IEEE, 2002-05-28

2
Study on Coined Solder Bumps on Micro-via PCBs

Nah, JW; Paik, Kyung-Wook; Kim, WH; Hur, KR, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.115 - 120, 3rd International Symposium on Electronic Materials and Packaging, 2001-11

3
Study on Coined Solder Bumps on PCB Pads

Paik, Kyung-Wook; Nah, JW; Kim, WH; Hur, KR, Proceedings of the 7th Pan Pacific Microelectronics Symposium, pp.79 - 85, 2002-02

4
The Solder Joint and Runner Metal Reliability of Wafer-Level CSP(Omega-CSP)

Yu, Jin; Kang, IS; Kim, JH; Park, IS; Hur, KR; Cho, SJ; Han, H, 50th Electronic Components and Technology Conference(ECTC), pp.87 - 92, 2000

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