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Showing results 1 to 6 of 6

1
A study on the 3D-TSV interconnection using wafer-level non-conductive adhesives (NCAs)

Choi, Y; Shin, J; Paik, Kyung-Wook, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1126 - 1129, ECTC, 2011-05-31

2
Composition and electrical properties of metallic Ru thin films deposited using Ru(C6H6)(C6H8) precursor

Choi, J; Choi, Y; Hong, J; Tian, H; Roh, JS; Kim, Y; Chung, TM; et al, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.41, pp.6852 - 6856, 2002-11

3
Effects of epoxy and rubber addition on die attach films (DAFs) materials properties

Choi, Y; Jang, KW; Chung, CK; Lee S.; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, ECTC 2009, pp.1525 - 1530, 123, 2009-05-26

4
Low-voltage organic transistors and depletion-load inverters with high-K pyrochlore BZN gate dielectric on polymer substrate

Choi, Y; Kim, Il-Doo; Tuller, HL; Akinwande, AI, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.52, pp.2819 - 2824, 2005-12

5
Mn-doped Ba0.6Sr0.4TiO3 high-K gate dielectrics for low voltage organic transistor on polymer substrate

Kang, KT; Lim, MH; Kim, Ho Gi; Choi, Y; Tuller, HL; Kim, Il-Doo; Hong, JM, APPLIED PHYSICS LETTERS, v.87, pp.2311 - 2330, 2005-12

6
The Correlation of DC Voltage from Inverse-Spin and Anomalous Hall Effect

Kim, S; Kim, D; Seo, M; Park, Byong-Guk; Choi, Y; Park, S, Magnetism and magnetic materials conference, Institute of Physics, 2014-11-07

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