Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Choi, TaeJin
Showing results 1 to 3 of 3
| Effect of the curing properties and viscosities of non-conductive films (NCFs) on ultra-fine pitch cu-pillar/sn-ag bump joint morphology and reliability Lee, HanMin; Choi, TaeJin; Park, SooIn; Paik, Kyung-Wook, 21st IEEE Electronics Packaging Technology Conference, EPTC 2019, pp.586 - 590, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Effects of the Curing properties and Viscosities of Non-Conductive Films (NCFs) on the Sn-Ag Solder Bump Joint Morphology and Reliability Lee, HanMin; Lee, Se Yong; Shin, SangMyung; Choi, TaeJin; Park, SooIn; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2278 - 2283, IEEE, 2019-05 |
| The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-mu m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection Lee, Seyong; Lee, Hanmin; Shin, SangMyung; Jang, MinGu; Choi, TaeJin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.6, pp.1167 - 1175, 2019-06 |
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