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A Study on the Curing properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly Lee, Hanmin; Lee, Seyong; Park, Jong-Ho; Chung, Chang-Kyu; Jang, Kyung-Woon; Kim, Il; Choi, SeongWoo; et al, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.2464 - 2469, IEEE-CPMT, 2018-06-01 |
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