Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Choi, HK
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| Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications Yim, MJ; Jung, IH; Choi, HK; Kim, K; Hwang, JS; Ahn, JY; Kwon, W; et al, 53rd Electronic Components and Technology Conference 2003, pp.1398 - 1403, IEEE, 2003-05-27 |
| Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12 |
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