Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Cho, SJ
Showing results 1 to 6 of 6
| Effects of Deformation-induced Twinning and Martensitic Transformation on the Cryogenic Machanical Properties of Fe-19Mn-5Cr-(0-5)Al-0.2C Alloys Hong, Soon-Hyung; Oh, BW; Cho, SJ; Kim, YG; Kim, WJ; Kim, YP, Plenum Press, Advanced in Cryogenic Engineering, pp.1183 - 1190, 1994-01-01 |
| Flip chip assembly on PCB substrates with coined solder bumps Nah, JW; Paik, Kyung-Wook; Cho, SJ; Kim, WH, 53rd Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2003-05-27 |
| Oxidation studies on a Cu-base leadframe alloy between 150 degrees C and 300 degrees C Cho, SJ; Paik, Kyung-Wook, SCRIPTA MATERIALIA, v.38, no.7, pp.1149 - 1154, 1998 |
| Studies on double-layered metal bumps for fine pitch flip chip applications Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; et al, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11 |
| Surface modification of SiAlON ceramics Lee, SM; Kim, HT; Baek, SS; Cho, SJ; Kang, Suk-Joong L, SIAIONS, v.237, pp.221 - 226, 2003 |
| The Solder Joint and Runner Metal Reliability of Wafer-Level CSP(Omega-CSP) Yu, Jin; Kang, IS; Kim, JH; Park, IS; Hur, KR; Cho, SJ; Han, H, 50th Electronic Components and Technology Conference(ECTC), pp.87 - 92, 2000 |
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