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Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package Zhang, Shuye; Duan, Ran; Xu, Sunwu; Xue, Panfei; Wang, Chengqian; Chen, Jieshi; Paik, Kyung-Wook; et al, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06 |
The In-Situ TEM Isothermal Aging Evolution in a μ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics Liu, Jinhong; Jing, Xinyi; Chen, Jieshi; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, ELECTRONIC MATERIALS LETTERS, v.20, no.3, pp.352 - 361, 2024-05 |
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