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A study on highly reliable flex-on-board interconnection using solder anisotropic conductive films (ACFs) and ultrasonic bonding method = 솔더 이방성 전도 필름과 초음파 본딩을 이용한 고신뢰성 Flex-On-Board 접속에 관한 연구link Kim, Yoo Sun; 김유선; et al, 한국과학기술원, 2015 |
Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks Jing, Xinyi; Luo, Keyu; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.26, pp.1663 - 1668, 2023-09 |
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