Showing results 1 to 1 of 1
Bottom-up filling of submicrometer features in catalyst-enhanced chemical vapor deposition of copper Shim, KC; Lee, HB; Kwon, OK; Park, HS; Koh, W; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.149, no.2, pp.109 - 113, 2002-02 |
Discover