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Showing results 195 to 195 of 195

195
전자 패키징용 Au 본딩와이어의 재결정 현상과 기계적 특성 = Recrystallization behavior and mechanical properties of gold bonding wire for electronic package applicationslink

송지영; Song, Ji-Young; et al, 한국과학기술원, 2004

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