Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject MICROSTRUCTURE
Showing results 190 to 194 of 194
| Wear-mechanical properties of filler-added liquid silicon infiltration C/C-SiC composites Kim, Se Young; Han, In Sub; Woo, Sang Kuk; Lee, Kee Sung; Kim, Do Kyung, MATERIALS & DESIGN, v.44, pp.107 - 113, 2013-02 |
| Wettability and interfacial morphology of Sn-3.0Ag-0.5Cu solder on electroless nickel plated ZnS transparent ceramic Zhang, Shuye; Zhu, Bingxuan; Zhou, Xiang; Wang, Xingxing; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.19, pp.17972 - 17985, 2019-10 |
| Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04 |
| Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate Jung, In-Yu; Cho, Moon-Gi; Lee, Hyuck-Mo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2301 - 2307, 2009-11 |
| 전자 패키징용 Au 본딩와이어의 재결정 현상과 기계적 특성 = Recrystallization behavior and mechanical properties of gold bonding wire for electronic package applicationslink 송지영; Song, Ji-Young; et al, 한국과학기술원, 2004 |
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