Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject MICROSTRUCTURE
Showing results 175 to 194 of 194
| Tailored Colloidal Stability and Rheological Properties of Graphene Oxide Liquid Crystals with Polymer-Induced Depletion Attractions Shim, Yul Hui; Lee, Kyung Eun; Shin, Tae Joo; Kim, Sang Ouk; Kim, So Youn, ACS NANO, v.12, no.11, pp.11399 - 11406, 2018-11 |
| The Crystal Orientation of beta-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.12, pp.2461 - 2469, 2009-12 |
| The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; Zhou, Hongzhi; Li, Rongqing; He, Peng; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11 |
| The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates Zhang, Shuye; Wang, Shaoan; Zhang, Shang; Chen, Xiangyu; Zeng, Chen; Paik, Kyung-Wook; He, Peng, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.7094 - 7099, 2023-11 |
| The effect of a dilution agent on the dipping exothermic reaction process for fabricating a high-volume TiC-reinforced aluminum composite Song, IH; Kim, Do Kyung; Hahn, YD; Kim, HD, SCRIPTA MATERIALIA, v.48, no.4, pp.413 - 418, 2003-02 |
| The effect of Ti on the sintering and mechanical properties of refractory high-entropy alloy TixWTaVCr fabricated via spark plasma sintering for fusion plasma-facing materials Waseem, Owais Ahmed; Lee, Junho; Lee, Hyuck-Mo; Ryu, Ho Jin, MATERIALS CHEMISTRY AND PHYSICS, v.210, pp.87 - 94, 2018-05 |
| The outstanding tensile strength of Ni-rich high entropy superalloy fabricated by powder metallurgical process Kang, Byungchul; Kong, Taeyeong; Ryu, Ho Jin; Hong, Soon Hyung, MATERIALS CHEMISTRY AND PHYSICS, v.235, 2019-09 |
| The phase decomposition in non-equimolar (ZrHfVNbMoW)Cx complex concentrated carbides via carbon content regulation Zhang, Wen; Li, Kunxuan; Chen, Lei; Shi, Zhan; Huo, Sijia; Wei, Boxin; Kang, Suk-Joong L.; et al, JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, v.44, no.3, pp.1396 - 1403, 2024-03 |
| The role and mechanism of a ZnTe buffer layer on the structural properties of the strained CdxZn1-xTe/ZnTe double quantum wells Kim, TW; Lee, DU; Lim, YS; Lee, JeongYong; Park, HL, SOLID STATE COMMUNICATIONS, v.106, no.3, pp.153 - 156, 1998-04 |
| Thermal stability of TiAlN/CrN multilayer coatings studied by atom probe tomography Choi, Pyuck-Pa; Povstugar, Ivan; Ahn, Jae-Pyeong; Kostka, Aleksander; Raabe, Dierk, ULTRAMICROSCOPY, v.111, no.6, pp.518 - 523, 2011-05 |
| Thermoelectric properties of AgPbmSbTem+2 (12 <= m <= 26) at elevated temperature Dow, H. S.; Oh, M. W.; Park, S. D.; Kim, B. S.; Min, B. K.; Lee, H. W.; Wee, Dang-Moon, JOURNAL OF APPLIED PHYSICS, v.105, no.11, 2009-06 |
| Three-dimensional Monte-Carlo simulation of grain growth in Pt-Co thin film Park, SI; Han, SS; Kim, HG; Park, Joong Keun; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.10, pp.965 - 971, 2002-10 |
| Two-layer crystallization of amorphous YMnO3 thin films on Si(100) substrates Yoo, DC; Lee, JeongYong; Kim, IS; Kim, YT, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.86, pp.149 - 151, 2003-01 |
| Ultra-high strength WNbMoTaV high-entropy alloys with fine grain structure fabricated by powder metallurgical process Kang, Byungchul; Lee, Junho; Ryu, Ho Jin; Hong, Soon Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.712, pp.616 - 624, 2018-01 |
| Ultrasensitive and Highly Selective Gas Sensors Based on Electrospun SnO2 Nanofibers Modified by Pd Loading Yang, Dae-Jin; Kamienchick, Itai; Youn, Doo Young; Rothschild, Avner; Kim, Il-Doo, ADVANCED FUNCTIONAL MATERIALS, v.20, no.24, pp.4258 - 4264, 2010-12 |
| Wear-mechanical properties of filler-added liquid silicon infiltration C/C-SiC composites Kim, Se Young; Han, In Sub; Woo, Sang Kuk; Lee, Kee Sung; Kim, Do Kyung, MATERIALS & DESIGN, v.44, pp.107 - 113, 2013-02 |
| Wettability and interfacial morphology of Sn-3.0Ag-0.5Cu solder on electroless nickel plated ZnS transparent ceramic Zhang, Shuye; Zhu, Bingxuan; Zhou, Xiang; Wang, Xingxing; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.19, pp.17972 - 17985, 2019-10 |
| Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04 |
| Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate Jung, In-Yu; Cho, Moon-Gi; Lee, Hyuck-Mo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2301 - 2307, 2009-11 |
| 전자 패키징용 Au 본딩와이어의 재결정 현상과 기계적 특성 = Recrystallization behavior and mechanical properties of gold bonding wire for electronic package applicationslink 송지영; Song, Ji-Young; et al, 한국과학기술원, 2004 |
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