Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject CU
Showing results 68 to 74 of 74
| Texture and sheet resistance of Al alloy thin films on Ti and TiN thin films Lee, WJ; Kim, SJ; Lee, WH; Lee, YJ; Lee, YS; Rha, SK; Park, Chong-Ook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.15, no.1, pp.9 - 13, 2004-01 |
| The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; Zhou, Hongzhi; Li, Rongqing; He, Peng; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11 |
| Thermodynamic assessment of the Ni-Bi binary system and phase equilibria of the Sn-Bi-Ni ternary system Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1536 - 1544, 2007-11 |
| Thermodynamic issues of lead-free soldering in electronic packaging Jeong, SW; Kim, JH; Lee, Hyuck-Mo, MATERIALS SCIENCE FORUM, v.426-4, pp.4081 - 4086, 2003 |
| Thermodynamic prediction of glass forming range in Al-Mg-REM ternary system Kim, YK; Soh, JR; Kim, HS; Lee, HyuckMo, CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, v.22, no.2, pp.221 - 230, 1998-06 |
| Tuning the C-1/C-2 Selectivity of Electrochemical CO2 Reduction on Cu-CeO2 Nanorods by Oxidation State Control Hong, Seungwon; Abbas, Hafiz Ghulam; Jang, Kyuseon; Patra, Kshirodra Kumar; Kim, Beomil; Choi, Byeong-Uk; Song, Hakhyeon; et al, ADVANCED MATERIALS, v.35, no.8, 2023-02 |
| (UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05 |
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