Showing results 156 to 195 of 195
Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints Kim, Sung-Hwan; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.25, no.9, pp.1854 - 1858, 2010-09 |
Segmentation of experimental datasets via convolutional neural networks trained on phase field simulations![]() Yeom, Jiwon; Stan, Tiberiu; Hong, Seungbum; Voorhees, Peter W., ACTA MATERIALIA, v.214, 2021-05 |
Segregation Stabilizes Nanocrystalline Bulk Steel with Near Theoretical Strength Li, Yujiao; Raabe, Dierk; Herbig, Michael; Choi, Pyuck-Pa; Goto, Shoji; Kostka, Aleksander; Yarita, Hiroshi; et al, PHYSICAL REVIEW LETTERS, v.113, no.10, 2014-09 |
Self-propagation Combustion Behavior with Varying Al/Ni Ratios in Compression-Bonded Ni-sputtered Al Foil Multilayers Kuk, Seoung Woo; Ryu, Ho Jin; Yu, Jin, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.45A, no.12, pp.5691 - 5698, 2014-11 |
Shear band-driven precipitate dispersion for ultrastrong ductile medium-entropy alloys![]() Jang, Tae Jin; Choi, Won Seok; Kim, Dae Woong; Choi, Gwanghyo; Jun, Hosun; Ferrari, Alberto; Koermann, Fritz; et al, NATURE COMMUNICATIONS, v.12, no.1, pp.4703, 2021-08 |
Sn-Ag-Cu 솔더의 응고 경로에 따른 미세 구조 연구 및 계면 IMC 성장 거동 모델링 = Study on microstructures through the solidification paths of Sn-Ag-Cu ternary system and modeling for predicting IMC layer thickness of solder jointlink 김현득; Kim, Hyun-Deuk; et al, 한국과학기술원, 2004 |
Spark plasma sintering behavior of nanocrystalline WC-10Co cemented carbide powders Cha, SI; Hong, Soon-Hyung; Kim, BK, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.351, pp.31 - 38, 2003-06 |
Stability of ordered L1(2) and B-2 precipitates in face centered cubic based high entropy alloys - Al0.3CoFeCrNi and Al0.3CuFeCrNi2 Gwalani, B; Soni, V; Choudhuri, D; Lee, M; Hwang, JY; Nam, SJ; Ryu, Ho Jin; et al, SCRIPTA MATERIALIA, v.123, pp.130 - 134, 2016-10 |
Strength enhancement and density reduction by the addition of Al in CrFeMoV based high-entropy alloy fabricated through powder metallurgy Raza, Ahmad; Ryu, Ho Jin; Hong, Soon Hyung, MATERIALS AND DESIGN, v.157, pp.97 - 104, 2018-11 |
Strengthening of Al0.3CoCrFeMnNi-based ODS high entropy alloys with incremental changes in the concentration of Y2O3 Gwalani, Bharat; Pohan, Rizaldy M.; Waseem, Owais Ahmed; Alam, Talukder; Hong, Soon Hyung; Ryu, Ho Jin; Banerjee, Rajarshi, SCRIPTA MATERIALIA, v.162, pp.477 - 481, 2019-03 |
STRUCTURAL AND OPTICAL-PROPERTIES OF HYDROGENATED AMORPHOUS-SILICON CARBIDE DEPOSITED BY GLOW-DISCHARGE FROM C3H8-SIH4-H2 MIXTURE Park, JH; Kwon, Hyuk-Sang; Lee, JY, JOURNAL OF APPLIED PHYSICS, v.72, no.11, pp.5246 - 5252, 1992-12 |
Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Choi, WK; Shih, DY, JOURNAL OF MATERIALS RESEARCH, v.18, no.1, pp.4 - 7, 2003-01 |
Study on morphology evolution, orientational behavior, and anisotropic phase formation of highly filled polymer-layered silicate nanocomposites Koo, CM; Kim, Sang Ouk; Chung, In Jae, MACROMOLECULES, v.36, no.8, pp.2748 - 2757, 2003-04 |
Study on Proton Radiation Resistance of 410 Martensitic Stainless Steels under 3 MeV Proton Irradiation Lee, Jae-Woong; Surabhi, S.; Yoon, Soon-Gil; Ryu, Ho Jin; Park, Byong-Guk; Cho, Yeon-Ho; Jang, Yong-Tae; et al, JOURNAL OF MAGNETICS, v.21, no.2, pp.183 - 186, 2016-06 |
Suppression of abnormal grain growth in WC-Co via pre-sintering treatment Yang, Dong-Yeol; Kang, Suk-Joong L, INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, v.27, pp.90 - 94, 2009-01 |
Surface modification effects of SiC tile on the wettability and interfacial bond strength of SiC tile/Al7075-SiCp hybrid composites Park, Jongbok; Lee, Junho; Jo, I; Cho, S; Lee, SK; Lee, SB; Ryu, Ho Jin; et al, SURFACE COATINGS TECHNOLOGY, v.307, pp.399 - 406, 2016-12 |
Synergistic reinforcement effects of ZrB2 on the ultra-high temperature stability of Cf/SiC composite fabricated by liquid silicon infiltration Kong, Jung Hoon; Lee, Seung Yong; Il Son, Young; Kim, Do Kyung, JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, v.43, no.8, pp.3062 - 3069, 2023-07 |
Synthesis and characterization of semiconductor oxide nanoparticles = 반도성 산화물 나노 입자 합성 및 특성 평가link Choi, Hong-Goo; 최홍구; et al, 한국과학기술원, 2004 |
Synthesis of aligned GaN nanorods on Si (111) by molecular beam epitaxy Kim, YH; Lee, JeongYong; Lee, SH; Oh, JE; Lee, HS, APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, v.80, pp.1635 - 1639, 2005-05 |
Synthesis of in-situ TiC-Al composite by dipping exothermic reaction process Song, IH; Kim, Do Kyung; Hahn, YD; Kim, HD, METALS AND MATERIALS INTERNATIONAL, v.10, pp.301 - 306, 2004-06 |
Tailored Colloidal Stability and Rheological Properties of Graphene Oxide Liquid Crystals with Polymer-Induced Depletion Attractions Shim, Yul Hui; Lee, Kyung Eun; Shin, Tae Joo; Kim, Sang Ouk; Kim, So Youn, ACS NANO, v.12, no.11, pp.11399 - 11406, 2018-11 |
The Crystal Orientation of beta-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.12, pp.2461 - 2469, 2009-12 |
The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; Zhou, Hongzhi; Li, Rongqing; He, Peng; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11 |
The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates Zhang, Shuye; Wang, Shaoan; Zhang, Shang; Chen, Xiangyu; Zeng, Chen; Paik, Kyung-Wook; He, Peng, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.7094 - 7099, 2023-11 |
The effect of a dilution agent on the dipping exothermic reaction process for fabricating a high-volume TiC-reinforced aluminum composite Song, IH; Kim, Do Kyung; Hahn, YD; Kim, HD, SCRIPTA MATERIALIA, v.48, no.4, pp.413 - 418, 2003-02 |
The effect of Ti on the sintering and mechanical properties of refractory high-entropy alloy TixWTaVCr fabricated via spark plasma sintering for fusion plasma-facing materials Waseem, Owais Ahmed; Lee, Junho; Lee, Hyuck-Mo; Ryu, Ho Jin, MATERIALS CHEMISTRY AND PHYSICS, v.210, pp.87 - 94, 2018-05 |
The outstanding tensile strength of Ni-rich high entropy superalloy fabricated by powder metallurgical process Kang, Byungchul; Kong, Taeyeong; Ryu, Ho Jin; Hong, Soon Hyung, MATERIALS CHEMISTRY AND PHYSICS, v.235, 2019-09 |
The phase decomposition in non-equimolar (ZrHfVNbMoW)Cx complex concentrated carbides via carbon content regulation Zhang, Wen; Li, Kunxuan; Chen, Lei; Shi, Zhan; Huo, Sijia; Wei, Boxin; Kang, Suk-Joong L.; et al, JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, v.44, no.3, pp.1396 - 1403, 2024-03 |
The role and mechanism of a ZnTe buffer layer on the structural properties of the strained CdxZn1-xTe/ZnTe double quantum wells Kim, TW; Lee, DU; Lim, YS; Lee, JeongYong; Park, HL, SOLID STATE COMMUNICATIONS, v.106, no.3, pp.153 - 156, 1998-04 |
Thermal stability of TiAlN/CrN multilayer coatings studied by atom probe tomography Choi, Pyuck-Pa; Povstugar, Ivan; Ahn, Jae-Pyeong; Kostka, Aleksander; Raabe, Dierk, ULTRAMICROSCOPY, v.111, no.6, pp.518 - 523, 2011-05 |
Thermoelectric properties of AgPbmSbTem+2 (12 <= m <= 26) at elevated temperature Dow, H. S.; Oh, M. W.; Park, S. D.; Kim, B. S.; Min, B. K.; Lee, H. W.; Wee, Dang-Moon, JOURNAL OF APPLIED PHYSICS, v.105, no.11, 2009-06 |
Three-dimensional Monte-Carlo simulation of grain growth in Pt-Co thin film Park, SI; Han, SS; Kim, HG; Park, Joong Keun; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.10, pp.965 - 971, 2002-10 |
Two-layer crystallization of amorphous YMnO3 thin films on Si(100) substrates Yoo, DC; Lee, JeongYong; Kim, IS; Kim, YT, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.86, pp.149 - 151, 2003-01 |
Ultra-high strength WNbMoTaV high-entropy alloys with fine grain structure fabricated by powder metallurgical process Kang, Byungchul; Lee, Junho; Ryu, Ho Jin; Hong, Soon Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.712, pp.616 - 624, 2018-01 |
Ultrasensitive and Highly Selective Gas Sensors Based on Electrospun SnO2 Nanofibers Modified by Pd Loading Yang, Dae-Jin; Kamienchick, Itai; Youn, Doo Young; Rothschild, Avner; Kim, Il-Doo, ADVANCED FUNCTIONAL MATERIALS, v.20, no.24, pp.4258 - 4264, 2010-12 |
Wear-mechanical properties of filler-added liquid silicon infiltration C/C-SiC composites Kim, Se Young; Han, In Sub; Woo, Sang Kuk; Lee, Kee Sung; Kim, Do Kyung, MATERIALS & DESIGN, v.44, pp.107 - 113, 2013-02 |
Wettability and interfacial morphology of Sn-3.0Ag-0.5Cu solder on electroless nickel plated ZnS transparent ceramic Zhang, Shuye; Zhu, Bingxuan; Zhou, Xiang; Wang, Xingxing; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.19, pp.17972 - 17985, 2019-10 |
Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04 |
Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate Jung, In-Yu; Cho, Moon-Gi; Lee, Hyuck-Mo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2301 - 2307, 2009-11 |
전자 패키징용 Au 본딩와이어의 재결정 현상과 기계적 특성 = Recrystallization behavior and mechanical properties of gold bonding wire for electronic package applicationslink 송지영; Song, Ji-Young; et al, 한국과학기술원, 2004 |
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