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Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint Kim, JH; Jeong, SW; Kim, HD; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1228 - 1234, 2003-11 |
The effect of Mo addition on the liquid-phase sintering of W heavy alloy Park, HD; Baik, WH; Kang, Suk-Joong L; Yoon, DY, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.27, no.10, pp.3120 - 3125, 1996-10 |
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