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Showing results 8 to 11 of 11

8
Impact Reliabilities of Lead-free Solder Joints with Ni(P), Cu and Ni metallizations

Yu, Jin; Sohn, YC; Kim, JY; Jee, YK; Ko, YH, ICEP 2006, 2006

9
Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations

Jee, YK; Kim, JY; Yu, Jin; Lee, TY, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.S1-b p3 -, 2007-11-19

10
Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM

Jee, YK; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.10, pp.2286 - 2291, 2010-10

11
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package

Jee, YK; Park, KW; Oh, TS; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.5, pp.685 - 690, 2009-05

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