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Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers Zhang, Shuye; Yang, Ming; Jin, Ming Liang; Huang, Wen-Can; Lin, Tiesong; He, Peng; Lin, Panpan; et al, METALS, v.8, no.1, 2018-01 |
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