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Formation of intermetallic compounds in the Ni bearing lead free composite solders Lee, JW; Lee, ZH; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2344 - 2350, 2005-11 |
Microstructure of a lead-free composite solder produced by an in-situ process s. y. hwang; j. w. lee; z. h. lee, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.11, pp.1304, 2002 |
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