Showing results 8 to 9 of 9
Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis Kwon, WS; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.24, pp.135 - 142, 2004-04 |
The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji-Hye; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.10, pp.1583 - 1591, 2017-10 |
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