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Showing results 8 to 11 of 11

8
Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly

Zhang, Shuye; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.78, pp.181 - 189, 2017-11

9
Highly mechanical and high-temperature properties of Cu–Cu joints using citrate-coated nanosized Ag paste in air

Wang, Qian; Zhang, Shuye; Lin, Tiesong; Zhang, Pengzhe; He, Peng; Paik, Kyung-Wook, PROGRESS IN NATURAL SCIENCE-MATERIALS INTERNATIONAL, v.31, no.1, pp.129 - 140, 2021-02

10
Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

Zhang, Shuye; Yang, Ming; Jin, Ming Liang; Huang, Wen-Can; Lin, Tiesong; He, Peng; Lin, Panpan; et al, METALS, v.8, no.1, 2018-01

11
Wettability and interfacial morphology of Sn-3.0Ag-0.5Cu solder on electroless nickel plated ZnS transparent ceramic

Zhang, Shuye; Zhu, Bingxuan; Zhou, Xiang; Wang, Xingxing; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.19, pp.17972 - 17985, 2019-10

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