Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Jee, YK
Showing results 4 to 11 of 11
| Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations Jee, YK; Xia, YH; Yu, Jin; Kang, HW; Lee, TY, 58th Electronic Components and Technology Conference, ECTC 2008, pp.491 - 494, 2008-05-27 |
| Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
| Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad Jee, YK; Ko, YH; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.7, pp.1879 - 1887, 2007-07 |
| Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints Jee, YK; Yu, Jin; Ko, YH, JOURNAL OF MATERIALS RESEARCH, v.22, no.10, pp.2776 - 2784, 2007-10 |
| Impact Reliabilities of Lead-free Solder Joints with Ni(P), Cu and Ni metallizations Yu, Jin; Sohn, YC; Kim, JY; Jee, YK; Ko, YH, ICEP 2006, 2006 |
| Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations Jee, YK; Kim, JY; Yu, Jin; Lee, TY, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.S1-b p3 -, 2007-11-19 |
| Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM Jee, YK; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.10, pp.2286 - 2291, 2010-10 |
| Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package Jee, YK; Park, KW; Oh, TS; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.5, pp.685 - 690, 2009-05 |
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