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Electrochemical Migration Behavior of a Fine-Pitch IC Substrate by Alternating Current Kim, Jongsoo; Park, Miseok; Nam, DoHwan; Kwon, Hyuk-Sang, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.14, no.11, pp.8258 - 8263, 2014-11 |
Eutectic Sn/Pb solder bump and under bump metallurgy (UBM) interfacial reaction and adhesion Jang, Se-Young; Paik, Kyung-Wook, SOLDERING & SURFACE MOUNT TECHNOLOGY, v.10, no.3, pp.29 - 37, 1998-03 |
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