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Copper chemical vapour deposition using copper(I) hexafluoroacetylacetonate trimethylvinylsilane Lee, WJ; Min, JS; Rha, SK; Chun , Soung Soon; Park, Chong-Ook; Kim, DW, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.7, no.2, pp.111 - 117, 1996-04 |
Plasma-enhanced atomic layer deposition of Ru-TiN thin films for copper diffusion barrier metals Kwon, SH; Kwon, OK; Min, JS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.153, no.6, pp.G578 - G581, 2006 |
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