Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Title 

Showing results 12481 to 12500 of 19354

12481
Relationship between Elastic Modulus and Texture of Gold Bonding Wire for Electronic Packaging Applications

Hong, Soon Hyung, pp.15 - 22, 2001-01-01

12482
Relationship between elastic properties and acoustic properties of EPDM rubber composites for underwater acoustic sensors

Hong, Soon Hyung, pp.1 - 4, 2002-01-01

12483
Relationship between Hydrogen-Assisted Crack Propagation and Fracture Mode in AISI 4340 Steel

변수일, Korean Corros. Sci. Soc., pp.6 - 6, 1989

12484
Relationship between interface and peel strength of Cu-Ni clads prepared by surface activated bonding

Hong, Soon-Hyung, NANO KOREA 2010, 2010-08-17

12485
Relationship between Interfacial Reaction and Adhesion at the PVD TiO2 Film/Metal(Ti or Al) Interface

Pyun, Su Il, Intern.Conf. on Met.Coatings and Thin Films, 1993

12486
Relationship between Mechanical Properties and Microstructure of Nannocrystalline Gold Bonding Wires

Kim, Kyung Seop; Song, Jiyoung; Chung, EK; Pakr, JK; Hong, Soon Hyung, International Symposium on Macro-, Meso-, Micro- and Nano-Mechanics of Materials, pp.167 - 169, International Symposium on Macro-, Meso-, Micro- and Nano-Mechanics of Materials, 2003-12-08

12487
Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires

Kim, KS; Song, JY; Chung, EK; Park, JK; Hong, Soon-Hyung, MECHANICS OF MATERIALS, v.38, pp.119 - 127, 2006-01

12488
Relationship between mechanical properties and microstructure of ultra-fine wires

홍순형; Kim, KS; Park, HJ; Na, KH, 4th Workshop on Milli-structure Manufacturing Technology, pp.16 - 21, 2003

12489
Relationship between mechanical properties and microstructure of ultra-fine wires

Hong, Soon-Hyung; Kim, KS; Park, HJ; Na, NH, 4th Korea-Japan Joint Symposium on Micro-Fabrication, pp.45 - 50, 2003-05-01

12490
Relationship between microstructure and tensile strength in the directionally solidified (23-27) at. % Al-Ni alloys

Lu, Y; Kim, HC; Lee, JH; Oh, MH; Wee, Dang-Moon; Hirano, T, ECO-MATERIALS PROCESSING DESIGN VII BOOK SERIES: MATERIALS SCIENCE FORUM, v.510-511, pp.458 - 461, 2006-04

12491
Relationship between the Preferred Orientation and Morphology of Pb-Sn-Cu Alloy Electrodeposits

변수일, Korean Corros. Sci. Soc., pp.8 - 8, 1988

12492
Relationships between suspension formulations and the properties of BaTiO3/epoxy composite films for integral capacitors

Cho, SD; Paik, Kyung-Wook, 51st 2001 Electronic Components and Technology Conference, pp.1418 - 1422, IEEE, 2001-05-29

12493
Relative humidity cycle testing on GE-HDI

Li, M; Wu, X; Pecht, M; Paik, Kyung-Wook; Bernard, E, INTERNATIONAL JOURNAL OF MICROELECTRONIC PACKAGING, v.1, no.1, pp.13 - 34, 1995-01

12494
Relativistic Motion of Antiferromagnetic Domain Walls Driven by Spin-orbit Torques", 2016 Spring Conference of the Korean Institute of Metals and Materials

Shiino, T; 오세혁; 박병국; 이경진, 2016 대한금속재료학회 춘계학술대회, 대한금속재료학회, 2016-04-27

12495
Relaxation of cathodoluminescent characteristics of phosphors at low-energy electron excitation

Bukesov, SA; Kim, JY; Jeon, DukYoung; Strel'tsov, AV, JOURNAL OF APPLIED PHYSICS, v.91, no.11, pp.9078 - 9082, 2002-06

12496
Relaxation of Crack Tip Stresses by Diffusive Growth of Frain Boundary Cavities

Yu, Jin; Jeon, JY, Proc. 5th Int. Conf. Strength of Materials(ICSMA-5), (The Japan Institute of Metals), pp.611 - 614, 1994-06-01

12497
Relaxation of phosphor screen characteristics of low voltage CL display devices

Jeon, Duk Young, pp.489 -, 2002-01-29

12498
Relaxation of remanent polarization in Pb(ZrTi)O-3 thin film capacitors

Lee, KW; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.41, pp.6718 - 6723, 2002-11

12499
Relaxation of remanent polarization in PZT thin film capacitors

Lee, Won-Jong, ISAF XIII, ISIF XIV, FMA XIX, pp.372 - 372, 2002-05-01

12500
Relaxation of remnant polarization in PZT thin film capacitors

Lee, Won-Jong; Lee, KW, International Joint Conference on the Applications of Ferroelectrics 2002, 2002-05-28

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