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Kim,Hyoung-Joon; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, pp.1003 - 1011, 2008-07
Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, pp.306 - 312, 2007-10
Hwang, JS; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.1722 - 1727, 2006-09
Hwang, JW; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1455 - 1461, 2005-11
Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12
Yim, MJ; Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.23, no.3, pp.171 - 176, 2000-07
Kim, Won-Chul; Lee, Ki-Won; Saarinen, Ilkka J.; Pykari, Lasse; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.884 - 889, 2012-05
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