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An angular distribution function for the sputter-depositing atoms and general equations describing the initial thickness profile of a thin film deposited inside a via and trench by sputtering Kim, Chang-Gyu; Lee, Won-Jong, THIN SOLID FILMS, v.519, no.1, pp.74 - 80, 2010-10 |
Filling of very fine via holes for three-dimensional packaging by using ionized metal plasma sputtering and electroplating Cho, Byeong-Hoon; Yun, Jae-Jin; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.46, no.45-49, pp.L1135 - L1137, 2007-12 |
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