Showing results 1 to 4 of 4
ACF-Packaged Flexible Flash Memory Array Kim, Do Hyun; Lee, Keon Jae, 2016년도 한국재료학회 추계학술대회, 사단법인 한국재료학회, 2016-11-17 |
Fabrication of the Packaging-Completed Flexible Si-based Device Using Flip-Chip Bonding Technology Kim, Do Hyun; Yoo, Hyeon Gyun; Lee, Keon Jae, 2015년 대한금속재료학회 추계학술대회, (사)대한금속 재료학회, 2015-10-30 |
Fully-Packaged Ultrathin Si-based Flexible NAND Flash Memory Kim, Do Hyun; Yoo, Hyeon Gyun; Lee, Keon Jae, 제 23회 한국반도체학술대회, 성균관대학교, 한국반도체산업협회, 한국반도체연구조합, 2016-02-24 |
Packaging-Completed Flexible NAND-Type Flash Memory Array Kim, Do Hyun; Lee, Keon Jae, The 16th International Meeting on Information Display, 한국정보디스플레이학회, The Society for Information Display, 한국디스플레이산업협회, 2016-08-24 |
Discover