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The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-mu m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection Lee, Seyong; Lee, Hanmin; Shin, SangMyung; Jang, MinGu; Choi, TaeJin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.6, pp.1167 - 1175, 2019-06 |
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