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Effect of Material Properties of Double-Layer Non Conductive Films (D-NCFs) On the Reflow Reliability of Ultra Fine-pitch Cu-pillar/Sn-Ag Micro Bump Interconnection Lee, Seyong; Shin, JiWon; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2110 - 2115, IEEE-CPMT, 2017-06-01 |
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