DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ukaegbu, Ikechi Augustine | ko |
dc.contributor.author | Kim, Do-Won | ko |
dc.contributor.author | Shirazy, Mohammed Shorab Muslim | ko |
dc.contributor.author | Lee, Tae-Woo | ko |
dc.contributor.author | Cho, Mu-Hee | ko |
dc.contributor.author | Park, Hyo-Hoon | ko |
dc.date.accessioned | 2013-08-08T06:00:18Z | - |
dc.date.available | 2013-08-08T06:00:18Z | - |
dc.date.created | 2013-06-24 | - |
dc.date.created | 2013-06-24 | - |
dc.date.issued | 2013-05 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.5, pp.740 - 748 | - |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.uri | http://hdl.handle.net/10203/174732 | - |
dc.description.abstract | For short- and long-wavelength vertical surface-emitting lasers (VCSELs), performances of optical transmitter array modules with vertically and horizontally packaged structures are analyzed for application to on-board optical interconnection. 850 and 1310 nm wavelengths are selected for the short- and long-wavelength light sources. For each wavelength, top- and bottom-emitting VCSELs are used to compare the performances of four different module structures: bottom-emitting types of 850 and 1310 nm for the vertical modules, and top- emitting types of 850 and 1310 nm for the horizontal modules. The horizontal transmitter modules are packaged using the conventional wire-bonding technology for the interconnect between VCSEL and driver chips while the vertical modules are packaged using the flip-chip-bonding technology. Signal crosstalk is investigated using 1 x 4 VCSEL array chips, which are driven using the same Si-CMOS circuits designed for 5 Gb/s operation. The vertical modules show lower crosstalk than the horizontal modules. When the gap distance between the VCSEL aperture and the waveguide input port increases up to 500 mu m for each module, the crosstalk increases in a range -58 to -37 dB. The 3-dB bandwidth performances are sensitively degraded in a range 4.6-2.0 GHz when the gap distance increases. In the crosstalk, the 1310-nm vertical module shows the best performance, while in the 3-dB bandwidth, the 850-nm horizontal module shows the best performance. The four modules shows clear eye openings at 2.5 Gb/s with bit error rate < 10(-12) and can be used for on-board optical interconnections. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | PRINTED-CIRCUIT BOARD | - |
dc.subject | SYSTEMS | - |
dc.title | Performance Analysis of Vertical and Horizontal Transmitter Array Modules Using Short- and Long-Wavelength VCSELS for Optical Interconnects | - |
dc.type | Article | - |
dc.identifier.wosid | 000318702100005 | - |
dc.identifier.scopusid | 2-s2.0-84877250705 | - |
dc.type.rims | ART | - |
dc.citation.volume | 3 | - |
dc.citation.issue | 5 | - |
dc.citation.beginningpage | 740 | - |
dc.citation.endingpage | 748 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
dc.identifier.doi | 10.1109/TCPMT.2013.2248151 | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Park, Hyo-Hoon | - |
dc.contributor.nonIdAuthor | Kim, Do-Won | - |
dc.contributor.nonIdAuthor | Shirazy, Mohammed Shorab Muslim | - |
dc.contributor.nonIdAuthor | Lee, Tae-Woo | - |
dc.contributor.nonIdAuthor | Cho, Mu-Hee | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Flip-chip bonding | - |
dc.subject.keywordAuthor | long-wavelength VCSEL | - |
dc.subject.keywordAuthor | optical interconnection | - |
dc.subject.keywordAuthor | optical multichip module | - |
dc.subject.keywordAuthor | optical printed-circuit board (OPCB) | - |
dc.subject.keywordAuthor | short-wavelength VCSEL | - |
dc.subject.keywordAuthor | Si-CMOS driver IC | - |
dc.subject.keywordPlus | PRINTED-CIRCUIT BOARD | - |
dc.subject.keywordPlus | SYSTEMS | - |
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