Fabrication of poly-Si/Au nano-gaps using atomic-layer-deposited Al2O3 as a sacrificial layer

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dc.contributor.authorChan Woo Park,ko
dc.contributor.authorHan Young Yuko
dc.contributor.authorUng Hwan Piko
dc.contributor.authorChoi, Sung-Yoolko
dc.date.accessioned2013-06-07T06:42:55Z-
dc.date.available2013-06-07T06:42:55Z-
dc.date.created2013-05-13-
dc.date.created2013-05-13-
dc.date.created2013-05-13-
dc.date.created2013-05-13-
dc.date.issued2005-04-
dc.identifier.citationNANOTECHNOLOGY, v.16, no.4, pp.361 - 364-
dc.identifier.issn0957-4484-
dc.identifier.urihttp://hdl.handle.net/10203/173748-
dc.description.abstractWe propose a new process of fabricating nano-gap electrode pairs using an atomic-layer-deposited (ALD) thin film as a sacrificial layer. In this technique, we can control the width of a gap precisely by varying the number of deposition cycles of the ALD layer, and produce many identical gaps simultaneously. Using ALD Al2O3 as a sacrificial layer, we have fabricated poly-Si/Au nano-gaps of 10 nm width successfully. This new approach can provide a useful tool for the massive production of integrated molecular device circuits.-
dc.languageEnglish-
dc.publisherIOP PUBLISHING LTD-
dc.titleFabrication of poly-Si/Au nano-gaps using atomic-layer-deposited Al2O3 as a sacrificial layer-
dc.typeArticle-
dc.identifier.wosid000228949300014-
dc.identifier.scopusid2-s2.0-24144496024-
dc.type.rimsART-
dc.citation.volume16-
dc.citation.issue4-
dc.citation.beginningpage361-
dc.citation.endingpage364-
dc.citation.publicationnameNANOTECHNOLOGY-
dc.identifier.doi10.1088/0957-4484/16/4/005-
dc.contributor.localauthorChoi, Sung-Yool-
dc.contributor.nonIdAuthorChan Woo Park,-
dc.contributor.nonIdAuthorHan Young Yu-
dc.contributor.nonIdAuthorUng Hwan Pi-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordPlusMETALLIC ELECTRODES-
dc.subject.keywordPlusLITHOGRAPHY-
dc.subject.keywordPlusSEPARATION-
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